?2007 ixys all rights reserved 1 - 4 20070625a ixkh 24n60c5 ixkp 24n60c5 ixys reserves the right to change limits, test conditions and dimensions. advanced technical information symbol conditions characteristic values (t vj = 25 c, unless otherwise speci ed) min. typ. max. r dson v gs = 10 v; i d = 12 a 150 165 m v gs(th) v ds = v gs ; i d = 0.9 ma 2.5 3 3.5 v i dss v ds = 600 v; v gs = 0 v t vj = 25? t vj = 125? tbd 1 a ? i gss v gs = 20 v; v ds = 0 v 100 na c iss c oss v gs = 0 v; v ds = 100 v f = 1 mhz 2000 100 pf pf q g q gs q gd v gs = 0 to 10 v; v ds = 400 v; i d = 12 a 40 9 13 45 n c nc nc t d(on) t r t d(off) t f v gs = 10 v; v ds = 400 v i d = 12 a; r g = 3.3 tbd tbd tbd tbd ns ns ns ns r thjc 0.5 k/w i d25 = 24 a v dss = 600 v r ds(on) max = 0.165 coolmos ? * power mosfet features ?fast coolmos * power mosfet - 4th generation - high blocking capability - lowest resistance - avalanche rated for unclamped inductive switching (uis) - low thermal resistance due to reduced chip thickness ?enhanced total power density applications ?switched mode power supplies (smps) ?uninterruptible power supplies (ups) ?power factor correction (pfc) ?welding ?inductive heating ?pdp and lcd adapter mosfet symbol conditions maximum ratings v dss t vj = 25? 600 v v gs 20 v i d25 i d90 t c = 25? t c = 90? 24 16 a a e as e ar single pulse repetitive 522 0.79 mj mj dv/dt mosfet dv/dt ruggedness v ds = 0...480 v 5 0 v/ns d g s n-channel enhancement mode low r dson , high v dss mosfet ultra low gate charge to-247 ad (ixkh) g d s i d = 7.9 a; t c = 25? *coolmos is a trademark of in neon technologies ag. to-220 ab (ixkp) g d s q d(tab)
?2007 ixys all rights reserved 2 - 4 20070625a ixkh 24n60c5 ixkp 24n60c5 ixys reserves the right to change limits, test conditions and dimensions. advanced technical information source-drain diode symbol conditions characteristic values (t vj = 25?, unless otherwise speci ed) min. typ. max. i s v gs = 0 v 12 a v sd i f = 12 a; v gs = 0 v 0.9 1.2 v t rr q rm i rm i f = 12 a; -di f /dt = 100 a/?; v r = 400 v 390 7.5 38 ns ? a component symbol conditions maximum ratings t vj t stg operating -40...+150 -40...+150 ? ? m d mounting torque to-247 to-220 0.8 ... 1.2 0.4 ... 0.6 nm nm symbol conditions characteristic values min. typ. max. r thch with heatsink compound to-247 to-220 0.25 0.50 k/w k/w weight to-247 to-220 6 2 g g
?2007 ixys all rights reserved 3 - 4 20070625a ixkh 24n60c5 ixkp 24n60c5 ixys reserves the right to change limits, test conditions and dimensions. advanced technical information c b f a h g l k j d n m e r q dim. millimeter inches min. max. min. max. a 12.70 13.97 0.500 0.550 b 14.73 16.00 0.580 0.630 c 9.91 10.66 0.390 0.420 d 3.54 4.08 0.139 0.161 e 5.85 6.85 0.230 0.270 f 2.54 3.18 0.100 0.125 g 1.15 1.65 0.045 0.065 h 2.79 5.84 0.110 0.230 j 0.64 1.01 0.025 0.040 k 2.54 bsc 0.100 bsc m 4.32 4.82 0.170 0.190 n 1.14 1.39 0.045 0.055 q 0.35 0.56 0.014 0.022 r 2.29 2.79 0.090 0.110 to-220 ab outline fig. 1 power dissipation fig. 2 typ. output characteristics fig. 3 typ. output characteristics 04 08 01 2 01 6 0 0 50 100 150 200 250 300 t c [ c] p tot [w] symbol inches millimeters min max min max a 0.185 0.209 4.70 5.30 a1 0.087 0.102 2.21 2.59 a2 0.059 0.098 1.50 2.49 d 0.819 0.845 20.79 21.45 e 0.610 0.640 15.48 16.24 e2 0.170 0.216 4.31 5.48 e0 . 2 1 5b s c5 . 4 6b s c l 0.780 0.800 19.80 20.30 l1 - 0.177 - 4.49 ?p 0.140 0.144 3.55 3.65 q 0.212 0.244 5.38 6.19 s0 . 2 42b s c6 . 1 4b s c b 0.039 0.055 0.99 1.40 b2 0.065 0.094 1.65 2.39 b4 0.102 0.135 2.59 3.43 c 0.015 0.035 0.38 0.89 d1 0.515 - 13.07 - d2 0.020 0.053 0.51 1.35 e1 0.530 - 13.45 - ?p1 - 0.291 - 7.39 to-247 ad outline 4.5 v 5v 5.5 v 6v 8v 10v 12v 20 v 0 20 40 60 80 0 5 10 15 20 v ds [v] i d ]a[ 4.5 v 5v 5.5 v 6v 8v 10 v 12v 20 v 0 10 20 30 40 051 01 52 0 v ds [v] i d ]a[ t j = 25c v gs = v gs = t j = 125c
?2007 ixys all rights reserved 4 - 4 20070625a ixkh 24n60c5 ixkp 24n60c5 ixys reserves the right to change limits, test conditions and dimensions. advanced technical information single pulse 0.01 0.02 0.05 0.1 0.2 0.5 10 0 10 -1 10 -2 10 -3 10 -4 10 -5 10 0 10 -1 10 -2 t p [s] z cjht ]w/k[ typ 98% 0 0.1 0.2 0.3 0.4 0.5 -60 -20 20 60 100 140 180 t j [c] r )no( sd [ ] 25 c 150 c 0 20 40 60 80 100 0246810 v gs [v] i d ] a[ 7v 10 v 0 0.2 0.4 0.6 0.8 1 1.2 0 1020304050 i d [a] r )no(sd [ ] 5v 5.5 v 6v 6.5 v 12 0v 40 0v 0 1 2 3 4 5 6 7 8 9 10 01 02 03 04 0 q gate [nc] v s g ]v[ 25 c 150 c 25 c, 98% 150 c, 98% 10 2 10 1 10 0 10 -1 00 . 511 . 52 v sd [v] i f ]a[ ciss coss crss 10 5 10 4 10 3 10 2 10 1 10 0 0 100 200 300 400 500 v ds [v] c] fp[ 0 100 200 300 400 500 600 20 60 100 140 180 t j [c] e s a ] j m[ 540 580 620 660 700 -60 -20 20 60 100 140 180 t j [c] v )s s d(r b ] v [ v ds = t jv = 150c i d = 12 a v gs = 10 v v ds > 2 r ds(on) max i d t j = t j = v ds = 120 v v gs = 0 v f = 1 mhz i d = 7.9 a i d = 0.75 ma d = t p /t i d = 12 a pulsed fig. 5 drain-source on-state resistance fig. 4 typ. drain-source on-state resistance characteristics of igbt fig. 7 forward characteristic of reverse diode fig. 8 typ. gate charge fig. 10 avalanche energy fig. 11 drain-source breakdown voltage fig. 6 typ. transfer characteristics fig. 9 typ. capacitances fig. 12 max. transient thermal impedance
|
